Feature
- SK Hynix demonstrated the advancement of their 321-layer 1Tb TLC1 4D NAND Flash.
- SK hynix is the first company to reveal in-depth development on a NAND memory with more than 300 layers.
- At FMS, SK Hynix revealed advanced NAND solutions for AI, including Gen5 SSDs and UFS 4.0, optimizing business applications.
At the Flash Memory Summit 2023, SK hynix Inc. unveiled a sample of their ground-breaking 321-layer 4D NAND, signaling a significant advancement in creating the market’s first NAND memory with more than 300 layers.
Presentation at FMS 2023
- SK Hynix demonstrated the advancement of their 321-layer 1Tb TLC1 4D NAND Flash.
- At the FMS, which took place from August 8 to August 10 in Santa Clara, the firm openly showcased samples of the 321-layer NAND.
Industry First Achievement
- SK hynix is the first company to reveal in-depth development on a NAND memory with more than 300 layers.
- By the first part of 2025, the business hopes to mass-produce the 321-layer device.
Read more:- LPDDR5X 24GB First Mobile DRAM Package Introduced by SK hynix
Technological Advancements
- The 238-layer NAND, presently in mass production, was a commercial success for SK Hynix, which helped them gain the technological know-how necessary to create the 321-layer product.
- SK Hynix conquers stacking limits, set to dominate and pioneer 300+ layer NAND memory, reshaping the market.
Improved Productivity and Capacity
- Comparing the 321-layer 1Tb TLC NAND to the previous 238-layer 512Gb version, productivity has increased by 59%.
- Enhanced cell stacking and more storage space on a single chip are made possible by technological advancements, which increase wafer-level production capacity.
Rising Demand for High-Performance Memory
Demand for high-performance, high-capacity memory systems that can process massive amounts of data quickly has increased due to the emergence of generative AI, represented by developments like ChatGPT.
Next-Generation NAND Solutions
- At Flash Memory Summit 2023, SK Hynix revealed advanced NAND solutions for AI, including Gen5 SSDs and UFS 4.0, optimizing business applications.
- To meet client demands, the design of these products aims to deliver industry-leading performance with a focus on high efficiency.
Commitment to Future Innovations
- SK hynix has announced the launch of PCIe Gen6 and UFS 5.0 development.
- The improvements in solution creation from the firm’s present products motivate the company to maintain its dedication to innovation.
Read more:- TSMC and Leading Industry Players Join Forces to Establish European Semiconductor Manufacturing Hub
Vision for the Future
- Jungdal Choi, Head of NAND Development, states that advancing 321-layer 4D NAND cements SK Hynix’s tech dominance in NAND.
- SK Hynix aims to maintain industry leadership through advanced NAND memory, meeting AI era demands with high performance and capacity.
