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MediaTek Dimensity 6000 Series Launched: Enhancing Mainstream 5G Devices

MediaTek Unveils the Dimensity 6100+: Empowering Mainstream 5G Devices with Premium Features and Accessible Pricing

Insight Convey by Insight Convey
July 11, 2023
MediaTek Dimensity 6000 Series

Credit: MediaTek

Feature

  • Dimensity 6100+ SoC (System-on-Chip) at an affordable price point.
  • The Dimensity 6100+ supports up to 108MP Non-ZSL (Zero Shutter Lag) cameras and enables 2K 30fps video capture.
  • In the third quarter of 2023, the first smartphones with the Dimensity 6100+ chipset are anticipated to be released.

MediaTek, a leading semiconductor company, has officially introduced its new MediaTek Dimensity 6000 Series chipset, designed to enhance the next generation of mainstream 5G devices. A variety of high-end features, including remarkable power efficiency, vivid displays, fast frame rates, AI-powered camera technologies, industry-leading low power consumption, and dependable Sub-6 5G connection, are available with the Dimensity 6100+ SoC (System-on-Chip) at an affordable price point.

Addressing the Growing Need for Mainstream 5G Devices

  • CH Chen, Deputy General Manager of MediaTek’s Wireless Communications Business Unit, emphasizes the importance of chipsets that cater to the increasing number of mainstream mobile devices with next-generation connectivity.
  • While operators in developed countries are converting customers from 4G LTE to 5G, developing markets are launching 5G networks rapidly.MediaTek-Dimensity-Hero-ENG.png (1728×2042)

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Key Features of the Dimensity 6100+ Chipset

Enhanced 5G Modem:

The Dimensity 6100+ integrates an advanced 5G modem supporting the 3GPP Release 16 standard. It incorporates up to 140MHz 2CC (2 Component Carrier) 5G Carrier Aggregation, reducing power consumption.

CPU Configuration:

The chipset consists of two Arm Cortex-A76 big cores and six Arm Cortex-A55 efficiency cores, providing notable enhancements in AI-powered camera support, 10-bit displays, GPU performance, and rich peripheral features.

Camera Capabilities:

The Dimensity 6100+ supports up to 108MP Non-ZSL (Zero Shutter Lag) cameras and enables 2K 30fps video capture. It also features AI-bokeh for stunning portraits and selfies and AI-color technology for users to showcase their creativity.

Power Efficiency:

MediaTek’s UltraSave 3.0+ technology reduces 5G power consumption by 20% compared to competitive solutions.

Premium Display Support:

The chipset supports 10-bit displays, reproducing over one billion colors for vibrant images and videos. It also helps frame rates ranging from 90Hz to 120Hz, ensuring a smooth user experience.

Expanding MediaTek’s 5G Portfolio

  • MediaTek’s 5G portfolio covers different price tiers, making great mobile experiences more accessible.
  • The Dimensity 9000 series targets flagship smartphones and tablets, the Dimensity 8000 family caters to premium mobile devices, and the Dimensity 7000 lineup expands the range of high-tech devices.
  • The new Dimensity 6000 series democratizes higher-end features by bringing them to mainstream 5G devices.

Availability

  • In the third quarter of 2023, the first smartphones with the Dimensity 6100+ chipset are anticipated to be released.

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Conclusion

The Dimensity 6100+ SoC from MediaTek Dimensity 6000 series significantly improves popular 5G devices. The chipset lets device makers keep ahead of the curve with its improved 5G modem, battery efficiency, AI-powered camera capabilities, and support for brilliant displays. Great mobile experiences are now more accessible thanks to the Dimensity 6000 series, which makes high-end features available to a larger audience.

Tags: 3GPP4G LTE5g5G NetworksAI-Color TechnologyAI-PoweredDimensity 6000 SeriesDimensity 6100+ SoCSub-6 5G ConnectionUltraSave 3.0+Zero Shutter Lag
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